Accelerated Adhesive Curing for Induction-Based Repair of Composites

Report No. ARL-TR-2103
Authors: McKnight, Steven H.; Fink, Bruce K.; Wells, Sean; Yarlagadda, Shridhar; Gillespie, John W., Jr
Date/Pages: October 1999; 37 pages
Note: Prepared in collaboration with Delaware Univ., Newark, DE.
Abstract: A methodology for accelerated curing of commercially available room- temperature curing paste adhesives is outlined. Cure kinetics of the adhesive were studied by thermochemical analysis, and degree of cure was related to processing parameters and cure cycles. Increasing the cure temperature to 100 degrees C reduced the cure time from 16 hr to approximately 15 min. for 98% cure. Induction-heating techniques were used to demonstrate rapid heating of adhesives at the bondline for lap shear specimens.
Distribution: Approved for public release
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Last Update / Reviewed: October 1, 1999