Induction Curing of a Phase-Toughened Adhesive

Report No. ARL-TR-2999
Authors: Christian J. Yungwirth, Eric D. Wetzel, and James M. Sands
Date/Pages: June 2003; 30 pages
Abstract: Phase-toughened epoxy/dicyandiamide adhesives were loaded with magnetic particle filler and then cured by induction processing. The effect of induction field magnitude and exposure time on bonding strength of the loaded adhesives was characterized. At low magnetic field amplitudes, bond strength increased significantly with exposure time, with the highest strength bonds occurring after 60-min exposures. At high magnetic field amplitudes, bond strength increased only slightly with exposure time, so that significant bond strength was reached after 15 min of exposure. In general, the induction-cured adhesives exhibited lower bond strengths than comparable oven-cured adhesives. All of these strength trends were likely due to process induced variations in the adhesive degree of cure, toughening phase development, or thermal degradation.
Distribution: Approved for public release
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Last Update / Reviewed: June 1, 2003