Flip Chip Hybridization Using Indium Bump Technology at ARL

Report No. ARL-TN-283
Authors: Kimberley A. Olver
Date/Pages: July 2007; 14 pages
Abstract: Flip chip hybridization bonding is a microelectronics packaging technique which directly connects an active device to a substrate facedown, eliminating the need for peripheral wirebonds. Solder material is used as the conductive link between the two parts. Soldier bumps are directly deposited onto the active regions of the device and substrate. The main type of solder bump used at the Army Research Laboratory is the indium solder bump. Indium bump technology has been a part of the electronic interconnect process field for many years. This report discusses the techniques of flip chip hybrid bonding using indium bumps.
Distribution: Approved for public release
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Last Update / Reviewed: July 1, 2007