Thermal Simulation of Four Die-Attach Materials

Report No. ARL-MR-0686
Authors: Gregory K. Ovrebo
Date/Pages: January 2008; 18 pages
Abstract: We performed a time-dependent simulation of thermal transfer in a circuit board, comparing the effects of using four different die-attach materials with high-power silicon carbide diodes. This simulation attempted to reproduce the results of a laboratory experiment in which thermal measurements were made of circuit boards under a time-varying load.
Distribution: Approved for public release
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Last Update / Reviewed: January 1, 2008