Microfabricated Amorphous Silicon Nanopillars on an Ultrasmooth 500-nm-thick Titanium Adhesion Layer

Report No. ARL-TR-6209
Authors: Collin R. Becker, Kenneth E. Strawhecker, Jonathan P. Ligda, and Cynthia A. Lundgren
Date/Pages: September 2012; 24 pages
Abstract: Amorphous silicon (Si) nanopillars are fabricated using electron beam lithography for a liftoff process. The nanopillars are fabricated on an ultrasmooth, 6.5-nm root mean square (RMS) roughness, 500-nm-thick titanium (Ti) layer using electron beam evaporation. Pillars ranging from 1001000 nm in diameter and approximately 200 nm in height are fabricated. Atomic force microscopy (AFM) and scanning electron microscope (SEM) images, including those collected by focused ion beam (FIB) milling, are presented to analyze the shape of the pillars and roughness of the Ti film. The smoother the Ti/Si interface, the more robust the adhesion of Si to Ti becomes.
Distribution: Approved for public release
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Last Update / Reviewed: September 1, 2012