Electronic Components for High-g Hardened Packaging

Report No. ARL-TR-3705
Authors: Morris S. Berman
Date/Pages: January 2006; 29 pages
Abstract: A survey of packaging technology applicable to high-g environments is presented. Specifics of the artillery gun launch environment are discussed. The advantages and disadvantages of various external techniques including underfill and potting are also discussed. Discussion of the impact of the manufacturing process and resulting defects is included. Some key failure mechanisms are also identified.
Distribution: Approved for public release
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Last Update / Reviewed: January 1, 2006