Infrared Imaging of Power Electronic Components

Report No. ARL-TR-3690
Authors: Dimeji Ibitayo
Date/Pages: December 2005; 16 pages
Abstract: It is often advantageous to perform in-situ temperature measurements on operating devices to ensure that they do not exceed their maximum allowable junction temperature. A number of techniques are available to perform such measurements. This report focuses on the use of an infrared imaging technique to perform non-contact thermal characterization on one or more devices under test.
Distribution: Approved for public release
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Last Update / Reviewed: December 1, 2005