Thermal Simulation of Four Die-Attach Materials

Report No. ARL-MR-0686
Authors: Gregory K. Ovrebo
Date/Pages: January 2008; 18 pages
Abstract: We performed a time-dependent simulation of thermal transfer in a circuit board, comparing the effects of using four different die-attach materials with high-power silicon carbide diodes. This simulation attempted to reproduce the results of a laboratory experiment in which thermal measurements were made of circuit boards under a time-varying load.
Distribution: Approved for public release
  Download Report ( 0.385 MBytes )
If you are visually impaired or need a physical copy of this report, please visit and contact DTIC.
 

Last Update / Reviewed: January 1, 2008