Flip Chip Bonding of 68x68 MWIR LED Arrays

Report No. ARL-RP-0265
Authors: Naresh Das, Kimberly Olver, and M. Taysing-Lara
Date/Pages: August 2009; 12 pages
Abstract: The flip-chip bonding process is optimized by varying the bonding pressure, temperature and time. The 68x68 mid wave infrared (MWIR) LED array was hybridized onto Si-CMOS driver array with same number of pixels. Each pixel has two indium bumps, one for cathode and another for anode. Both LED array and CMOS drivers have 15 micron square Indium bump contact pads. We used Karl Suss FC150 flip chip machine for bonding of CMOS driver array onto LED array. From the LED current-voltage characteristics it is concluded that the optimized flip-chip bonding process results in uniform contact and very low contact resistance. Both electrical and optical characteristics of LED array after flip-chip bonding are presented.
Distribution: Approved for public release
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Last Update / Reviewed: August 1, 2009