A New Procedure for the Application and Curing of Polyimide Film on Gold Coated Silicon Wafers

Report No. ARL-TR-5031
Authors: Kimberley A. Olver
Date/Pages: November 2009; 16 pages
Abstract: A new repeatable process was developed for fabricating a polyimide-coated silicon wafer patterned with gold grating lines on the polyimide surface. A silicon wafer was first metalized with gold, followed by a cured polyimide layer, and the resulting polyimide layer was then patterned on the surface with gold grating lines. The project required the polyimide layer to be a uniform thickness across a 2-in silicon wafer. The polyimide coating needed to adhere to the gold undercoating and needed to be patterned with very narrow (on the order of 1.5 microns) repeating gold lines.
Distribution: Approved for public release
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Last Update / Reviewed: November 1, 2009