A New Technique for Wirebonding Using Indium Spheres

Report No. ARL-TR-5240
Authors: Kimberley A. Olver
Date/Pages: July 2010; 14 pages
Abstract: A new technique has been developed for wirebonding mercury cadmium telluride (MCT) devices using indium spheres. Indium powder with a mesh size of 170/200 is made up of indium spheres. These spheres are used as solder between the gold pad on the MCT device and the gold ball of the wirebond. This novel technique eliminates damage that typically occurs to the MCT material under gold wirebonding pads due to force and ultrasonic power needed in wirebonding.
Distribution: Approved for public release
  Download Report ( 0.260 MBytes )
If you are visually impaired or need a physical copy of this report, please visit and contact DTIC.
 

Last Update / Reviewed: July 1, 2010