Fabrication of 3D Silicon-based Photonic Crystal Structure with "Single" Self Aligned Etching Process

Report No. ARL-TN-0407
Authors: Gerard Dang, Monica Taysing-Lara, and Weimin Zhou
Date/Pages: September 2010; 14 pages
Abstract: We have designed and developed a simplified three-dimensional (3D) photonic crystal (PhC) fabrication technique that can be used to fabricate a nanoscale 3D structure from the two-dimensional (2D) surface of a silicon (Si), or silicon on insulator (SOI) wafer with a single modified Bosch plasma etching process. Using this technique, we demonstrated such a PhC structure that includes hollow-core waveguides with high-contrast gratings as cladding. The etching process produces deep trenches with controlled width variation along the vertical direction. This method uses only a single mask (such as e-beam lithography mask) without alignment, and there is no need for deposition, regrowth, etc. This technique may greatly reduce the fabrication cost and increase the yield of 3D PhC devices.
Distribution: Approved for public release
  Download Report ( 0.522 MBytes )
If you are visually impaired or need a physical copy of this report, please visit and contact DTIC.
 

Last Update / Reviewed: September 1, 2010