Predicting Deformation and Strain Behavior in Circuit Board Bend Testing

Report No. ARL-CR-0693
Authors: Ronen Aniti
Date/Pages: May 2012; 18 pages
Abstract: This report presents mathematical and finite element (FE) models that were used to predict the deformation and strain levels of a circuit board under a variety of four-point monotonic bend test configurations. The derivations of the mathematical models for deformation and strain are examined, and an equation modeling the strain rate of the board as it is bending is presented. The two and three-dimensional (2-D and 3-D) FE models are discussed and validated and the differences in deformation and strain levels between the models are accounted for. A convergence study was conducted to determine the optimal number of elements to use in these models and the results are also presented. In addition, key trends in the computed deformation and strain data across various test configurations are identified.
Distribution: Approved for public release
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Last Update / Reviewed: May 1, 2012