Characterization of Magnetron Sputtered Copper-Nickel Thin Film and Alloys

Report No. ARL-TR-7783
Authors: Eugene Zakar, Andrew Chen, Robert Burke, Samuel G Hirsch, Nicholas Strnad, and James Mulcahy
Date/Pages: September 2016; 18 pages
Abstract: Copper (Cu)-nickel (Ni) thin films are prepared by magnetron sputtering using an AJA International model ATC-2200 system. The as-deposited films are in the amorphous state during room temperature deposition but transition to a crystalline state at an elevated substrate temperature beyond 250 ℃. The crystalline films have a mixed (111)- and (200)-oriented texture that becomes predominantly (111)-orientated after an annealing treatment. Bilayer CuNi deposited films with ratio of 12:1, 6:1, 4:1, and 3:1 produced final alloy concentrations of 90/10, 83/17, 76/24, and 70/30 atomic %, respectively, after annealing, and their average surface roughness increased with higher Cu concentration. These results show that the final thin film alloy composition can be effectively controlled by varying the ratio of the initial deposited Cu and Ni layers. The morphology of these films were studied by atomic force microscope (AFM), X-ray Diffraction (XRD), electrical 4-point probe, and energy-dispersive X-ray spectroscopy (EDX).
Distribution: Approved for public release
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Last Update / Reviewed: September 1, 2016