The Army relies on the Army Research Laboratory (ARL) to provide the
critical links between the scientific and military commu
|
Overview
|
|
Electronic components are recognized as key force
multipliers in today’s Army and will remain so for the foreseeable future.
To maintain our technological advantage, the U.S. Army Research Office’s
Electronics Division seeks to support scientific and engineering endeavors
in research areas that possess the potential to define new electronic
capabilities or to enhance future electronic performance. The Electronic
research sub-areas are Solid State Devices, Optoelectronics, Quantum
Electro-Magnetic Devices, Sensors and Detectors, Electromagnetics and RF
Circuit Integration, Power Electronics, and Terahertz Science and
Technology.
|
|
1.1 Solid State Devices
|
|
This research
area emphasizes efforts to establish a new and comprehensive base of knowledge
for the electronic, photonic, acoustic and magnetic properties of
solid-state materials, structures and devices. Functions such as very
intelligent surveillance and target acquisition; command, control, and
communications; electronic warfare; and reconnaissance, must be
accomplished with the high data rates and real‑time capability that
are essential for these applications. To support the U.S. Army
vision of Objective Force and Future Combat System of Systems (FCSS),
these systems will need to operate at much higher speeds and frequencies,
have greatly increased functionality, and have much higher levels of
integration than present day technology provides. Therefore,
fundamental research in the area of Solid State Devices is the corner
stone and an essential requirement in the development of these future
systems for military defense.
To establish
the needed science base for future Army battle-space capabilities,
innovative research is sought in the general areas of:
- Novel
electronic materials for advanced devices
- Nanoscale
processing and fabrication science
- Nano/molecular
electronic science and technology
- Nanoscale
physical modeling and advanced simulation
- Ultrafast
electronics
- Advanced
device concepts
- Mixed
technologies (electronic, photonic, acoustic and magnetic)
- Heterogenous
devices and technologies
- Micromachined
devices and ultra-low-power technologies.
The program
currently emphasizes fundamental research in Nanoscale Growth and
Processing Science, Nanoscale (Semiconductor) Electronics, Molecular
Electronics, and Advanced Device Concepts, with a focus towards
identifying and overcoming existing scientific barriers.
Important
science and technological barriers include, but are not limited to:
1) The
discovery and implementation of new and revolutionary growth techniques
for engineering materials and for mixing and matching diverse material
systems.
2) The
development of novel processing, fabrication and self-assembly techniques
for realizing effective integration of diverse materials and devices into
ultra-dense and complex solid-state electronic systems.
3) The
establishment of a theoretical base of knowledge into conventional and
non-traditional (molecular) nanoscale electronics for bridging the gap
between today’s microelectronics to the future where molecular devices
will be integrated with nanoscale semiconductor devices and components.
4) The
development and implementation of accurate physical models and robust
simulation tools for identifying novel ultra-small device concepts and
complexly coupled nanosystems and accurately predicting their behavior.
5) The
development of a comprehensive science base that will provide fundamental
insights into quantum-confined structures with time dynamic,
non-equilibrium, dissipative electronic processes that are imbedded in
practical circuits with realistic interconnects.
6) The
development of new and effective integration techniques for realizing
complex heterogeneous devices (i.e., devices utilizing different
materials and operating on different physical principals) and mixed
technology systems.
Technical Point
of Contact (TPOC): Dr. Dwight Woolard, email: dwight.woolard@us.army.mil, (919) 549-4297
<<back to top>>
|
|
1.2 Optoelectronics
|
|
Research in
this subarea includes novel semiconductor structures, processing
techniques, and integrated optical components. The generation,
guidance and control of optical/infrared signals in both semiconductor
and dielectric materials are of interest. The Army has
semiconductor laser research opportunities based on quantum dot and
quantum well semiconductor materials operating in the eye-safe
(>1.55), 3‑5, 8‑12, and 18-24 microns regions for various
applications, such as ladar, IR countermeasures, and free
space/integrated data links. Research is necessary in semiconductor
materials growth and device processing to improve the efficiency and
reliability of the output of devices at these wavelengths.
High
performance devices and components will be optimized for applications
including high-data-rate optical networks. Interfacing of opto-electronic
devices with electronic processors will be investigated for full
utilization of available bandwidth. Electro-optic components will
be studied for use in guided wave data links for interconnections and
optoelectronic integration, all requirements for high speed full
situational awareness. Optical interconnect components are needed in
guided-wave data links for computer interconnection and in free-space
links for optical switching and processing. For optical processing
of images, research leading to two-dimensional (2-D) arrays of
surface-emitting lasers is necessary. Research addressing
efficient, novel optical components, such as optical micro-electro-mechanical
systems (MEMs) is needed. Emitters and architectures for novel
display and processing of battlefield imagery are important.
Technical Point
of Contact: Dr. Michael Gerhold, e-mail: mike.gerhold@us.army.mil , (919) 549-4357.
<<back to top>>
|
|
|
1.3 Quantum Electro-Magnetic Devices
|
|
The Army has a need for devices
and components that exploit multi-field interactions in suitable materials
leading to a new class of quantum-effect devices for sensing, display, data
storage, and information handling. Research on the generation,
detection and control of electronic, optical, and magnetic signals in both
semiconductor and dielectric materials is of interest. In particular,
novel electro-magnetic processes leading to greater manipulation and
increased sensing/data handling capabilities are to be considered.
Crystalline and amorphous wide bandgap semiconductor materials are of
interest as host materials for rare earth and transition metal ions.
Typical applications for these materials include robust, multicolor,
multi-layer thin film displays and spin-polarized sensors for chem.-bio
detection. Such devices will be especially critical in the
development of miniature, unmanned platforms operating in hostile
environments. In order to realize such devices it is necessary to explore
the electrical, optical, magnetic, and acoustical multi-field interactions
in advanced materials, such as AlGaInN, AlGaP, and ZnO. Novel structures,
at the micro- and nano-scale level, need to be developed to optimize the
multi-field quantum-effect interactions. Device concepts that exploit
these interactions for enhanced sensing, display, data storage, and
information handling need to be explored. In order to establish the science
base for this new class of quantum-effect devices, innovative research is
sought in the general areas of:
a. techniques
for achieving specific electronic, optical, and magnetic properties of wide
bandgap semiconductor materials,
b.
Rare-earth and transition metal doping of semiconductors and dielectrics,
c.
UV-visible photonics in III-V nitride compound semiconductors,
d.
Efficient eye safe, solid state and gas lasers leading to high power
operation, and
e.
Control of photonic-magnetic interactions in nanostructures.
Research is to include
demonstration of proof of principle devices employing novel phenomena and
interactions. Research issues relating to design, modeling, and fabrication
of these devices are of interest. Characterization of materials and
devices at the nanoscale is to be performed to determine the electrical,
optical, magnetic, and piezo-electric properties of prototype
devices. This knowledge is to be used to understand the limitations of
such quantum-effect devices and to establish the basis for unique sensing,
display, data storage, and information handling opportunities. These
investigations are necessary to determine the ultimate performance ranges
of field-controlled, quantum-effect nano-devices and to provide increased
functionality and capabilities for the FCS.
Technical
Point of Contact: Dr John Zavada, email: john.zavada@us.army.mil 919-549-4238
<<back to top>>
|
|
1.4 Sensors and Detectors
|
|
The ultimate goal of Army sensors
is 100% situational awareness to include day/night, all weather,
non-line-of-sight and through natural and man-made obstructions for sensing
of vehicles, personnel, weapons, chemical and biological threats,
projectiles, explosives, landmines, IEDs, and motion. Sensing technologies
of interest to this research sub-area currently include acoustic; seismic;
passive electromagnetic; hyperspectral, and infrared. Other innovative
sensors that meet an Army need are also welcome. Note that chemical,
biological, and radar sensors are generally funded through other
sub-areas.
Novel infrared detectors and
multispectral structures are of particular interest. Efforts are sought
that raise the operating temperature of “cooled,” high performance,
infrared detectors, as well as, efforts that increase performance of
“uncooled” infrared detectors. Research opportunities include components
based on quantum confined devices and semiconductor materials operating in
the infrared 1-24 microns regions. Also of interest is the ultra-violet
spectral region. In both regions, studies involving growth, defects,
interfaces, substrates, doping, and other electronic characteristics will
be considered.
Technical
Point of Contact: Dr. William Clark, email: william.w.clark@us.army.mil , 919-549-4314.
<<back
to top>>
|
|
1.5
Electromagnetics and RF Circuit Integration
|
|
Army Transformation is driving
the need for basic research supporting mobile, multifunctional, reliable,
and high-performance communications and sensor systems. In Electromagnetics
and RF Circuit Integration, this research falls into the following general
technical areas: computational electromagnetics, antennas, RF component
development, RF circuit integration, and landmine/UXO/IED detection.
Problems of interest in
computational electromagnetics can be divided into two regimes: device,
circuit, package, and antenna modeling at short length scales, and radio
wave propagation modeling at large length scales.
Advanced models and simulations
tools must be developed to accurately predict device, circuit, package,
antenna, and system performance. Of special interest are physically-based
models that enable the simulation of integrated circuits and modules as the
levels of integration increase and as the circuits become denser and more
complex. The coupling of radiation into and out of complex structures is a
problem of special interest. New analysis concepts, techniques, and
methodologies are needed with improvements in algorithm speed and
efficiency including model order reduction, design for inherently low
computational dispersion, and hardware acceleration. The human interface
for these tools should simplify the problem setup, data presentation and
analysis process, possibly including knowledge-based tools enabling the
integration of multiple computational engines.
Propagation effects have a major
impact on communications and radar systems. Research is sought leading to
innovative and efficient techniques for near-real-time propagation
modeling, capable of point-to-point calculations over paths that include
urban, rural, and foliated environments with natural and man-made
structures including tunnels, validated with appropriate experimental data,
with effective interactivity and information delivery to the user.
Innovative approaches are needed
to increase the performance and decrease the size and signature of tactical
antennas operating from the HF to W frequency bands. Novel and new
materials, configurations, and fabrication techniques for multifrequency,
multiband operation are of interest. This will require fast frequency
switching circuits and techniques for tunable antennas that minimize
nonlinear effects over a wide band of frequencies. Radically innovative
approaches are needed to increase the performance and reduce the cost of
electronically steerable apertures (ESA), including the antenna elements
and ancillary components. Ultimately, completely new approaches are sought
for a new class of antenna elements that are efficient, point sensors and
radiators of the vector electromagnetic fields with little or no mutual
coupling for highly oversampled antenna arrays giving improved direction
finding capabilities and radiation pattern control.
The electronic systems of the
future will operate in an increasingly dynamic and complex spectral
environment. This drives the need for innovative concepts that will produce
devices and components with extremely high dynamic range, extremely wide
instantaneous bandwidth, extremely high linearity, and multi-channel phase
tracking. These requirements apply to active devices such as power
amplifiers and low-noise amplifiers, as well as to passive components such
as filters, mixers, couplers, etc. Because these devices and components
will be used in mobile systems and because energy storage technology has
not kept pace with developments in electronic technologies, the active
components must also be energy efficient with low instantaneous peak power
requirements and the passive components must have low losses. Optimal
partitioning between digital and analog technology combined with new
circuit topologies will be critical.
Integration technologies provide
millimeter-wave/microwave circuits at small size, lightweight, low cost,
and high reliability. Novel techniques for integrating circuits are of
special interest at higher frequencies in order to overcome loss, coupling,
and spurious radiation problems. Hybrid techniques that combine high
performance from component optimization with low fabrication cost due to
compatibility with high volume production processes are needed. Fabrication
and integration techniques including dense 3-D and heterogeneous
integration must be developed that give the system designer access to
transmission lines with constant impedance over wide frequency range,
inter-layer high-frequency and optical interconnect, hermetic
self-packaging, and ease of assembly and handling. Thermal/mechanical
effects must be analyzed and minimized. Innovative approaches such as
micromachining will provide significant advantages for circuit integration
and the production and integration of passive components, including
integrated antennas.
Innovative electromagnetic and
hybrid approaches are needed for the detection of landmines, unexploded
ordnance, and improvised explosive devices. Radar, acoustic electromagnetic
induction, gravitometers, nuclear and infrared techniques have been applied
in traditional approaches. Innovations on the traditional approaches and
hybrid combinations with potential improvements in usability and
probability of detection with significant reduction in false alarm rate are
of interest to this program.
Technical Point of Contact: Dr.
Dev Palmer, e-mail: dev.palmer@us.army.mil , 919-549-4246.
<<back
to top>>
|
|
1.6 Terahertz
Science & Technology
|
|
This research area emphasizes
efforts to establish a new scientific foundation for understanding and
utilizing terahertz (THz) frequency sensing as a new tool for the
detection, identification and characterization of chemical and biological
(CB) agents on the battlefield. This research area also includes a
parallel thrust to identify and develop advanced device concepts that are
suitable for realizing THz-frequency sensors and sensor systems that are
militarily useful (i.e., compact, robust, cost effect, etc.) in realistic
battlefield scenarios.
To establish the needed science
and technology base for future Army battle-space capabilities, innovative
research is sought in the general areas of THz frequency sensing science
and advanced device concepts that facilitate robust functionality at frequencies
within the submillimeter-wave or THz frequency regimes (i.e., the part of
the electromagnetic spectrum between approximately 1 mm (300 GHz) and 100
μm (3 THz). To improve device performance, the Army is
interested in new device and circuit concepts, including quantum transport
devices such as resonant tunneling structures, and quantum-transition
devices in which photon emission can occur through intersubband transitions
between quasi-bound states. It also includes traditional devices with
revolutionary circuit and packaging techniques to improve
performance. The components of particular interest are
electrically-driven room-temperature sources, cw or pulsed, operating
between ~ 0.3 and 3 THz. Innovative and novel methodologies should be
explored until an effective approach is discovered or developed. Here, the
development of efficient sources and integrated semiconductor-based
components and systems is a priority.
In addition, a key application of
interest for terahertz and ultrafast electronics is battlefield remote
sensing of biological agents. Another second class of application is
point detection of biological/chemical agents and explosives, such as RDX
and TNT that also interact with THz radiation via low-frequency vibrations
and rotational modes. Rapid, unambiguous identification of chemical agents,
precursors, and degradation products is required in many areas of the DoD
including treaty verification and counter-terrorism. The ultra-high
resolution offered by THz spectroscopy may provide this rapid
identification even when the substance is in a complex mixture. A
final, and possibly even more far-reaching application of THz electronics,
is in the development of concepts for extending ultra-wideband sensing and
communications. Indeed, the fusion of an advanced THz-frequency
sensing capability with conventional sensor-network communications and
high-speed data processing has the potential for significantly enhancing
the network-centric capability of the Army’s Future Combat System of
Systems (FCSS) concept. Here, THz electronics will collectively impact
spectroscopic sensing, radiometric imaging and data transmission/
processing. Furthermore, commercial local-area-wireless networks can
already be envisioned at frequencies as high as 400 GHz, therefore, THz
electronics has a strong duel use potential and the potential for
significantly impacting the high-frequency electronics of the future.
Technical Point of Contact
(TPOC): Dr. Dwight Woolard, email: dwight.woolard@us.army.mil, (919) 549-4297
<<back to top>>
The goal of Power Electronics is
to reduce the logistics burden on the warfighter through research and
development into new and better ways to manage and create power for Army
electronic components and systems. The research area includes the design
of low peak power, highly efficient circuits and protocols for
communications, radar transmitters, unattended ground sensors, and soldier
electronics. It also involves high power management systems for all
electric vehicles, directed energy systems, and high energy lasers. It
involves novel power generation and distribution concepts including
biomimetics, distributed generation, and nuclear batteries. It also
includes renewable power strategies such as photovoltaics and energy
harvesting, but does not include chemical battery or fuel cell technology.
Technical Point of Contact: Dr. Dev Palmer, e-mail: dev.palmer@us.army.mil,
919-549-4246.
<<back
to top>>
|
|
|
|