Characterization of Low Density Glass Filled Epoxies

Report No. ARL-TR-2938
Authors: Matthew J. Quesenberry, Phillip H. Madison, and Robert E. Jensen
Date/Pages: March 2003; 22 pages
Abstract: This report discusses the experimental determination and modeling of several thermophysical and mechanical properties of glass filled epoxy composite systems for potential use as electronic potting compounds. Resin systems containing diglycidyl ether of bisphenol A epoxy, dicyandiamide curing agent, and 2-methylimidazole catalyst were produced with three different combinations of fillers: (1) solid glass spheres, (2) hollow glass spheres, and (3) mixed solid-hollow glass spheres. The density ( ρ), coefficient of thermal expansion, and Young?s modulus (E) of these different particulate filled composites were experimentally determined and modeled to elucidate the relationship between specific filler characteristics and resulting mechanical and thermophysical properties. The S-Combining Rule was found to correlate well with the experimental results for the solid glass sphere filled composites, but failed to accurately model ultimate composite properties when the hollow glass spherical filler was incorporated. The inaccuracy of micromechanical rules applied to the low-density composites was due to the minimal differences in modulus between the hollow spherical glass filler (Ef) and Em. However, reasonable micromechanical modulus approximations for the composites containing mixed hollow and solid spherical glass filler could be obtained.
Distribution: Approved for public release
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Last Update / Reviewed: March 1, 2003