Simulation of Heating of Oil-Cooled Switch Modules

Report No. ARL-MR-0630
Authors: Gregory K. Ovrebo
Date/Pages: November 2005; 22 pages
Abstract: I used solid modeling and finite element fluid dynamics codes to simulate the thermal characteristics of switch modules built from silicon carbide bipolar junction transistors (BJTs) and Schottky diodes. The results of the simulation can be used in conjunction with thermal management techniques to mitigate heating of high power, high temperature electronics and minimize the risk of damage during operation.
Distribution: Approved for public release
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Last Update / Reviewed: November 1, 2005