UV Baked/Cured Photoresist Used as a Sacrificial Layer in MEMS Fabrications

Report No. ARL-MR-602
Authors: Thomas P. Takacs, Jeff Pulskamp, and Ronald Polcawich
Date/Pages: February 2005; 14 pages
Abstract: MEMS fabrication requires the release of compliant mechanical structures. A sacrificial layer is typically used to provide as a structural layer on which device layers can be deposited and subsequently removed to leave a suspended or freestanding device. There are several sacrificial layers commonly used in MEMS fabrication such as SiO2, polysilicon and polyimide. We have developed a sacrificial layer technique that can be used when many other sacrificial layers cannot be used. The use of photoresist that is Ultra Violet (UV) baked/cured as a sacrificial layer can save process steps, time and money. It can also be removed without the inherent problem of residues or stiction from wet processing, material by-products or the problematic issue of determining if the film has been completely removed.
Distribution: Approved for public release
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Last Update / Reviewed: February 1, 2005