Evaluation of the Submodeling Technique for Analyzing Electronic Components

Report No. ARL-TR-3627
Authors: Brian M. Powers and David A. Hopkins (both of ARL)
Date/Pages: October 2005; 25 pages
Abstract: The use of submodeling in a finite element model for structural response is investigated for a simple structure representative of an electronic circuit board subjected to projectile launch conditions. The basic technique and rationale for submodeling are discussed. The consequences of sampling rate when one is using the global model?s response as input for the local model?s response are also highlighted. Aditionally, the effect of submodeling in introducing artificial high frequency response is shown. Finally, it is shown that with proper selection of model parameters, submodeling can provide accurate stress results of electronic components in conditions similar to gun launch.
Distribution: Approved for public release
  Download Report ( 1.274 MBytes )
If you are visually impaired or need a physical copy of this report, please visit and contact DTIC.

Last Update / Reviewed: October 1, 2005